Semiconductor
Electroplating Industry
The semiconductor, at the heart of every electronic device, plays a vital role in the digital era. There is a growing demand for precision in manufacturing and product quality to continue the miniaturization and performance enhancement of the key component. For example, it is necessary to control the coating thickness of the lead-frame in packaging, because the thickness directly impacts conductivity, thermal resistance and service life of semiconductors. Equipped with the smart FP algorithm, coating thickness analyzers are able to analyze samples with up to 10 plated layers and unknown samples by modelling. The spectrometers provide a professional solution for coating inspection and help accelerate the high-quality development of the semiconductor industry.
Challenges
Accuracy Requirement
The coating thickness is usually in micrometers or even nanometers. The same element in different layers may affect signal analysis.
Detection Difficulty
Semiconductors are of compact and complex structures. Semiconductors involve various materials and complex processes.
Material & Process
Most of analyzers rely on standard samples to analyze, which is time-consuming and inaccurate.
Advantages
Intelligent Algorithm
- Equipped with the smart FP algorithm, the analyzer is able to accurately measure the thickness and composition of coatings at the same time.
Micro-motion Platform
- The analyzer supports multi-point tests of tiny samples by virtue of the micro-motion platform.
Unknown Sample Analysis
- Without standard samples, the spectrometer is able to analyze unknown samples in a fast and accurate way.
Instrument
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